Compatible with non-conductive physical vapor deposition (PVD) sputtering processes, provides a high-gloss, metallic surface to enhance the appearance of smartphones. The polyetherimide (PEI) material also features excellent chemical resistance for durability, light weight for usability, and a balance of ductility and strength for structural parts.
Compared to titanium, stainless steel and aluminum, which require time-consuming machining, the new grade can be cost-effectively manufactured using high-speed, high-volume injection molding. It is also much lighter than metal options. Furthermore, as a non-conductive, metallized polymer, the resin eliminates the need for an unsightly antenna split in the middle frame. Using metal frames with plastic antenna splits can create a non-uniform appearance that impacts styling.
Another incumbent frame material, glass fiber-reinforced polycarbonate (PC) resin, typically uses non-conductive vacuum metallization (NCVM). This multi-layer process creates a thick coating that can accumulate along edges and corners, preventing a clean, sharp line. In contrast, PVD metallization is simpler and produces a much thinner profile. Furthermore, glass fiber in the PC resin can migrate, creating an uneven surface that affects gloss. Unreinforced resin ensures a smooth, high-gloss finish and resists abrasion and cracking better than softer PC resins.
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