Glass fibre reinforced partially aromatic polyamide for injection moulding. High toughness, stiffness and strength, low water absorption, high melting point (285°C).
| Original Document | Technical Datasheet-ISO(English) | |||
| Resin ID | PA6T/6-GF50 | |||
| Features | High StrengthHigh Stiffness/RigidityGood ToughnessFilled & Reinforced | |||
| Processing | Injection | |||
| Diagrams | Stress-strainStress-strain (Cond.)Secant modulus-strainSecant modulus-strain (Cond.)Stress-strain (isochronous)(Creep) 23°C (cond.)Creep modulus-time 23°C (cond.)Tensile modulus-temperatureTensile modulus-temperature (cond.) | |||
| Reinforced | 50% Glass Fiber | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ISO 1183 | |
Mold Shrinkage | |||
Flow | *** % | ISO 294-4 | |
Across Flow | *** % | ISO 294-4 | |
Molding Shrinkage | |||
constrained | *** % | - | |
Water Absorption | ***~*** % | ISO 62 | Equilibrium, 23°C, 50% RH |
Water Absorption | ***~*** % | ISO 62 | Saturation, 23°C |
Viscosity | *** cm³/g | ISO 307, 1157, 1628 | 0.5% in 96 % H2SO4 |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | Dry |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | cond. |
Tensile Strength | |||
Break | *** Mpa | ISO 527-1/-2 | Dry |
Break | *** Mpa | ISO 527-1/-2 | cond. |
Tensile Elongation | |||
Break | *** % | ISO 527-1/-2 | Dry |
Break | *** % | ISO 527-1/-2 | cond. |
Tensile Creep Modulus | |||
1000h | *** Mpa | ISO 899-1 | cond. |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Charpy Notched Impact Strengh | |||
23℃ (73℉) | *** kJ/m² | ISO 179/1eA | Dry |
Charpy Unnotched Impact Strengh | |||
-30℃ (-22℉) | *** kJ/m² | ISO 179/1eU | Dry |
-30℃ (-22℉) | *** kJ/m² | ISO 179/1eU | cond. |
23℃ (73℉) | *** kJ/m² | ISO 179/1eU | Dry |
23℃ (73℉) | *** kJ/m² | ISO 179/1eU | cond. |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ISO 75-1/-2 | |
Specific Heat | *** J/kg-K | - | |
Coefficient of Linear Thermal Expansion | |||
Flow | *** E-6/K | ISO 11359-1/-2 | 23-55℃ |
Across Flow | ***~*** E-6/K | ISO 11359-1/-2 | 23-55℃ |
Melt Temperature(Tm) | *** °C | ISO 11357-1/-3 | DSC |
Thermal Conductivity | *** W/(m K) | DIN 52612-1 | |
Temperature at Short Circle Operation | *** °C | - | |
Processing Temperature | ***~*** °C | - | |
Mould temperature | ***~*** °C | - | |
Temperature index (TI)-Tensile Strength | |||
5000 h | *** °C | IEC 60216 | |
20000 h | *** °C | IEC 60216 | |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
HB | *** mm | IEC 60695-11-10 | |
FMVSS | *** pass | FMVSS 302 | thickness d>= 1mm |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-m | IEC 60093 | Dry |
Volume Resistivity | *** Ohm-m | IEC 60093 | cond. |
Surface Resistivity | *** Ohm | IEC 60093 | cond. |
Dielectric Constant(Permittivity) | |||
1MHz | *** - | IEC 60250 | Dry |
1MHz | *** - | IEC 60250 | cond. |
Dissipation Factor | |||
1MHz | *** E-4 | IEC 60250 | Dry |
1MHz | *** E-4 | IEC 60250 | cond. |
Comparative Tracking Index (CTI) | |||
Solution A | *** V | IEC 60112 | Dry |
Solution A | *** V | IEC 60112 | cond. |
Dielectric Strength | *** kV/mm | IEC 60243-1 | Dry |
Dielectric Strength | *** kV/mm | IEC 60243-1 | cond. |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
