Injection molding grade with 30% glass beads for low-warpage technical parts (eg PCBs, chassis and housings).
| Original Document | Technical Datasheet-ISO(English) | |||
| Resin ID | PBT-GB30 | |||
| Features | Low WarpageFilled & Reinforced | |||
| Processing | Injection | |||
| Diagrams | Viscosity-shear rateShearstress-shear rateStress-strainSecant modulus-strainStress-strain (isochronous)(Creep) 23°CStress-strain (isochronous)(Creep) 40°CStress-strain (isochronous)(Creep) 60°CStress-strain (isochronous)(Creep) 90°CStress-strain (isochronous)(Creep) 120°CStress-strain (isochronous)(Creep) 160°CCreep modulus-time 23°CCreep modulus-time 40°CCreep modulus-time 60°CCreep modulus-time 90°CCreep modulus-time 120°CCreep modulus-time 160°CTensile modulus-temperature | |||
| Reinforced | 30% Glass Bead | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ISO 1183 | |
Melt Volume Flow Rate(MVR) | |||
250℃/2.16 kg | *** cm³/10 min | ISO 1133 | |
Molding Shrinkage | |||
Flow | *** % | Internal | plate with film gate 150*150*3 mm³ |
Across Flow | *** % | Internal | plate with film gate 150*150*3 mm³ |
Water Absorption | *** % | ISO 62 | equilibrium 23°C/50% r.h. |
Water Absorption | *** % | ISO 62 | equilibrium in water at 23°C |
Viscosity | *** cm³/g | ISO 307, 1157, 1628 | solution 0,005 g/ml Phenole/1,2 Dichlorbenzol 1:1 |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | |
Tensile Strength | |||
Break | *** Mpa | ISO 527-1/-2 | |
Tensile Elongation | |||
Break | *** % | ISO 527-1/-2 | |
Tensile Creep Modulus | |||
1000h | *** Mpa | ISO 899-1 | strain <= 0,5%, 23°C |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Charpy Notched Impact Strengh | |||
23℃ (73℉) | *** kJ/m² | ISO 179/1eA | |
Charpy Unnotched Impact Strengh | |||
-30℃ (-22℉) | *** kJ/m² | ISO 179/1eU | |
23℃ (73℉) | *** kJ/m² | ISO 179/1eU | |
| Hardness | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Ball Indentation Hardness | *** Mpa | ISO 2039-1 | at 358 N and 30 s |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
0.45 Mpa (66 psi)（4.6kg/cm²） | *** °C | ISO 75-1/-2 | |
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ISO 75-1/-2 | |
Specific Heat | *** J/kg-K | - | |
Coefficient of Linear Thermal Expansion | |||
Flow | ***~*** E-6/K | ISO 11359-1/-2 | 23-80℃ |
Melt Temperature(Tm) | *** °C | ISO 11357-1/-3 | DSC |
Thermal Conductivity | *** W/(m K) | DIN 52612-1 | |
Temperature at Short Circle Operation | *** °C | - | |
Processing Temperature | ***~*** °C | - | |
Mould temperature | ***~*** °C | - | |
Temperature index (TI)-Tensile Strength | |||
5000 h | *** °C | IEC 60216 | |
20000 h | *** °C | IEC 60216 | |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
HB | *** mm | IEC 60695-11-10 | |
HB | *** mm | IEC 60695-11-10 | |
FMVSS | *** pass | FMVSS 302 | thickness d>= 1mm |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-m | IEC 60093 | |
Surface Resistivity | *** Ohm | IEC 60093 | |
Dielectric Constant(Permittivity) | |||
100Hz | *** - | IEC 60250 | |
1MHz | *** - | IEC 60250 | |
Dissipation Factor | |||
100Hz | *** E-4 | IEC 60250 | |
1MHz | *** E-4 | IEC 60250 | |
Comparative Tracking Index (CTI) | |||
Solution A | *** V | IEC 60112 | |
Solution B | *** V | IEC 60112 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
