30% Glass Fiber Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.35mm
ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors.
| Original Document | Technical Datasheet(English) | |||
| Resin ID | PPA-GF30 FR(40) | |||
| Features | Flame RetardantHalogen FreeNon Red PhosphorusFilled & Reinforced | |||
| Additive | Flame Retardant | |||
| Applications | Surface mount technology (SMT)ConnectorsFPC connectorsWtB and BtB Connectors | |||
| Processing | Injection | |||
| Compliance | JEDEC MSL | |||
| Automotive Specs | Hyundai-KIA MS941-03 | |||
| Diagrams | Stress-strainStress-strain (Cond.)Viscosity-shear rateDynamic Shear modulus (G storage)-temperatureSpecific volume-temperature (pvT)Dynamic Shear modulus-temperatureSecant modulus-strainSecant modulus-strain (Cond.) | |||
| Reinforced | 30% Glass Fiber | |||
| Physical | Dry/Cond.(Sign in to View) | Unit | Test Standard | Test Condition |
|---|---|---|---|---|
Density/Specific Gravity | ***/ *** | g/cm³ | ISO 1183 | |
Mold Shrinkage | ||||
Flow | ***/ * | % | ISO 294-4 | |
Across Flow | ***/ * | % | ISO 294-4 | |
Moisture /Humidity Absorption | ***/ * | % | ISO 62 | |
| Mechanical | Dry/Cond.(Sign in to View) | Unit | Test Standard | Test Condition |
Tensile Modulus | ***/ *** | Mpa | ISO 527-1/-2 | |
Tensile Modulus | ***/ *** | Mpa | ISO 527-1/-2 | 120°C |
Tensile Modulus | ***/ * | Mpa | ISO 527-1/-2 | 160°C |
Tensile Strength | ||||
Break | ***/ *** | Mpa | ISO 527-1/-2 | |
Break | ***/ * | Mpa | ISO 527-1/-2 | 120°C |
Break | ***/ * | Mpa | ISO 527-1/-2 | 160°C |
Tensile Elongation | ||||
Break | ***/ *** | % | ISO 527-1/-2 | |
Break | ***/ *** | % | ISO 527-1/-2 | 120°C |
Break | ***/ * | % | ISO 527-1/-2 | 160°C |
Flexural Modulus | ***/ *** | Mpa | ISO 178 | |
Flexural Strength | ||||
- | ***/ *** | Mpa | ISO 178 | |
| Impact | Dry/Cond.(Sign in to View) | Unit | Test Standard | Test Condition |
Charpy Notched Impact Strengh | ||||
23℃ (73℉) | ***/ *** | kJ/m² | ISO 179/1eA | |
Charpy Unnotched Impact Strengh | ||||
23℃ (73℉) | ***/ *** | kJ/m² | ISO 179/1eU | |
| Thermal | Dry/Cond.(Sign in to View) | Unit | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | ||||
1.8 Mpa (264 psi)（18.6kg/cm²） | ***/ * | °C | ISO 75-1/-2 | |
Relative Temperature Index(RTI), Elec | ||||
0.75/0.8mm | ***/ * | °C | UL 746B | |
Coefficient of Linear Thermal Expansion | ||||
Flow | ***/ * | E-6/°C | ISO 11359-1/-2 | |
Flow | ***/ * | E-6/°C | ASTM D 696 | |
Across Flow | ***/ * | E-6/°C | ISO 11359-1/-2 | |
Across Flow | ***/ * | E-6/°C | ASTM D 696 | |
Melt Temperature(Tm) | ***/ * | °C | ISO 11357-1/-3 | |
| Flammability | Dry/Cond.(Sign in to View) | Unit | Test Standard | Test Condition |
Flame Rating | ||||
V-0 | ***/ * | mm | UL94 | |
V-0 | ***/ * | mm | UL94 | |
V-0 | ***/ * | mm | UL94 | |
V-0 | ***/ * | mm | IEC 60695-11-10 | |
V-0 | ***/ * | mm | IEC 60695-11-10 | |
| Electrical | Dry/Cond.(Sign in to View) | Unit | Test Standard | Test Condition |
Dielectric Constant(Permittivity) | ||||
100Hz | ***/ *** | - | IEC 62631-2-1 | |
1MHz | ***/ *** | - | IEC 62631-2-1 | |
1 GHz | ***/ *** | - | IEC 61189-2-721 | |
Comparative Tracking Index (CTI) | ||||
- | ***/ *** | V | IEC 60112 | |
- | ≥ ***/ * | V | IEC 60112 | above 600V |
Dielectric Strength | ***/ *** | kV/mm | IEC 60243-1 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
