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Ultramid® B3WG10

PA6

BASF

Product Description

Glass fibre reinforced and heat ageing resistance injection moulding grade forindustrial parts requiring very high rigidity.

General
Original Document
Technical Datasheet(English)
Resin ID
PA6-GF50
Features
High Stiffness/Rigidity
Good Heat Aging
Filled & Reinforced
Processing
Injection
Automotive Specs
FORD WSK-M4D674-A
GM(General Motors) GMW3029P-PA6-GF50H
Diagrams
Dynamic Shear modulus (G storage)-temperature
Dynamic Shear modulus (G storage)-temperature (cond.)
Stress-strain
Stress-strain (Cond.)
Secant modulus-strain
Secant modulus-strain (Cond.)
Stress-strain (isochronous)(Creep) 23°C (cond.)
Stress-strain (isochronous)(Creep) 60°C
Stress-strain (isochronous)(Creep) 90°C
Stress-strain (isochronous)(Creep) 120°C
Creep modulus-time 23°C (cond.)
Creep modulus-time 60°C
Creep modulus-time 90°C
Creep modulus-time 120°C
Tensile modulus-temperature
Tensile modulus-temperature (cond.)
Reinforced
50% Glass Fiber
Specifications
Physical Value/Unit(Sign in to View) Test Standard Test Condition

Density/Specific Gravity

*** g/cm³ ISO 1183

Melt Volume Flow Rate(MVR)

275°C/5 kg

*** cm³/10 min ISO 1133

Mold Shrinkage

Flow

*** % ISO 294-4

Across Flow

*** % ISO 294-4

-

*** % Internal
constrained

Water Absorption

***~*** % ISO 62
saturation in water at 23°C

Moisture /Humidity Absorption

***~*** % ISO 62
equilibrium 23°C/50% r.h.

Viscosity

*** cm³/g ISO 307, 1157, 1628
0.5% in 96% H2SO4

Spiral Flow

*** mm -
d = 2.0 mm
Mechanical Value/Unit(Sign in to View) Test Standard Test Condition

Tensile Modulus

*** Mpa ISO 527-1/-2
Cond.

Tensile Modulus

*** Mpa ISO 527-1/-2
Dry

Tensile Modulus

*** Mpa ISO 527-1/-2
Dry, 80°C

Tensile Strength

Break

*** Mpa ISO 527-1/-2
Cond.

Break

*** Mpa ISO 527-1/-2
Dry

Break

*** Mpa ISO 527-1/-2
Dry, 80°C

Tensile Elongation

Break

*** % ISO 527-1/-2
Cond.

Break

*** % ISO 527-1/-2
Dry

Break

*** % ISO 527-1/-2
Dry, 80°C

Flexural Modulus

*** Mpa ISO 178
Cond.

Flexural Modulus

*** Mpa ISO 178
Dry

Flexural Strength

-

*** Mpa ISO 178
Cond.

-

*** Mpa ISO 178
Dry

Tensile Creep Modulus

1000h

*** Mpa ISO 899-1
strain ≤ 0.5%, 23°C
Impact Value/Unit(Sign in to View) Test Standard Test Condition

Charpy Notched Impact Strengh

-30℃ (-22℉)

*** kJ/m² ISO 179/1eA
Cond.

-30℃ (-22℉)

*** kJ/m² ISO 179/1eA
Dry

23℃ (73℉)

*** kJ/m² ISO 179/1eA
Cond.

23℃ (73℉)

*** kJ/m² ISO 179/1eA
Dry

Charpy Unnotched Impact Strengh

-30℃ (-22℉)

*** kJ/m² ISO 179/1eU
Cond.

-30℃ (-22℉)

*** kJ/m² ISO 179/1eU
Dry

23℃ (73℉)

*** kJ/m² ISO 179/1eU
Cond.

23℃ (73℉)

*** kJ/m² ISO 179/1eU
Dry

Izod Notched Impact Strengh

23℃ (73℉)

*** J/m ASTM D256
Cond.

23℃ (73℉)

*** J/m ASTM D256
Dry

23℃ (73℉)

*** kJ/m² ISO 180/A
Cond.

23℃ (73℉)

*** kJ/m² ISO 180/A
Dry
Thermal Value/Unit(Sign in to View) Test Standard Test Condition

Heat Deflection Temperature(HDT)

0.45 Mpa (66 psi)(4.6kg/cm²)

*** °C ISO 75-1/-2

1.8 Mpa (264 psi)(18.6kg/cm²)

*** °C ISO 75-1/-2

Specific Heat

*** J/kg-K -

Coefficient of Linear Thermal Expansion

Flow

*** E-6/K ISO 11359-1/-2
(23-55)°C

Across Flow

*** E-6/K ISO 11359-1/-2
(23-55)°C

Melt Temperature(Tm)

*** °C ISO 11357-1/-3
DSC

Thermal Conductivity

*** W/(m K) DIN 52612-1

Temperature at Short Circle Operation

*** °C -

Processing Temperature

***~*** °C -
Injection moulding/Extrusion

Mould temperature

***~*** °C -
Injection moulding

Temperature index (TI)-Tensile Strength

5000 h

*** °C IEC 60216
50% loss of tensile strength

20000 h

*** °C IEC 60216
50% loss of tensile strength
Flammability Value/Unit(Sign in to View) Test Standard Test Condition

Flame Rating

HB

*** mm IEC 60695-11-10

HB

*** mm IEC 60695-11-10

FMVSS

*** pass FMVSS 302
Thickness ≥ 1 mm

Burning Rate

*** mm/min ISO 3795
Thickness ≥ 1 mm
Electrical Value/Unit(Sign in to View) Test Standard Test Condition

Volume Resistivity

*** Ohm-m IEC 62631-3-1
Cond.

Volume Resistivity

*** Ohm-m IEC 62631-3-1
Dry

Surface Resistivity

*** Ohm IEC 62631-3-2
Cond.

Surface Resistivity

*** Ohm IEC 62631-3-2
Dry

Dielectric Constant(Permittivity)

1MHz

*** - IEC 62631-2-1
Cond.

1MHz

*** - IEC 62631-2-1
Dry

Dissipation Factor

1MHz

*** E-4 IEC 62631-2-1
Cond.

1MHz

*** E-4 IEC 62631-2-1
Dry

Dielectric Strength

*** kV/mm IEC 60243-1
Cond.,K20/K20, (60*60*1 mm³)

Dielectric Strength

*** kV/mm IEC 60243-1
Dry, K20/K20, (60*60*1 mm³)

The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.