Without halogens flame retardant glass fiber reinforced injection moulding grade for plastic parts in electrical applications. The product is light colorable and provides good mechanical and electrical properties. Due to the halide free stabilization the impact on corrosion is minimized and sensitive electronic components are better protected. In particular optimized for the glow wire requirements of IEC 60335.
| Original Document | Technical Datasheet(English) | |||
| Solutions | Solutions for automotive charging systems | |||
| Resin ID | PA6-GF30 FR(53+30) | |||
| Features | Flame RetardantHalogen FreeFilled & Reinforced | |||
| Additive | Flame Retardant | |||
| Processing | Injection | |||
| Diagrams | Dynamic Shear modulus (G storage)-temperatureDynamic Shear modulus (G storage)-temperature (cond.)Stress-strain(Break)Stress-strain (Cond.)(Break)Secant modulus-strain(Break)Secant modulus-strain (Cond.)(Break)Stress-strain (isochronous)(Creep) 23°C (cond.)Stress-strain (isochronous)(Creep) 60°CStress-strain (isochronous)(Creep) 90°CStress-strain (isochronous)(Creep) 120°CStress-strain (isochronous)(Creep) 140°CCreep modulus-time 23°C (cond.)Creep modulus-time 60°CCreep modulus-time 90°CCreep modulus-time 120°CCreep modulus-time 140°CCoefficient of Linear Thermal Expansion(CTE)-TemperatureTensile modulus-temperatureTensile modulus-temperature (cond.) | |||
| Reinforced | 30% Glass Fiber | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ISO 1183 | |
Melt Volume Flow Rate(MVR) | |||
275°C/5 kg | *** cm³/10 min | ISO 1133 | |
Mold Shrinkage | |||
Flow | *** % | ISO 294-4 | |
Across Flow | *** % | ISO 294-4 | |
Water Absorption | ***~*** % | ISO 62 | saturation in water at 23°C |
Moisture /Humidity Absorption | ***~*** % | ISO 62 | equilibrium 23°C/50% r.h. |
Viscosity | *** cm³/g | ISO 307, 1157, 1628 | 0.5% in 96% H2SO4 |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | Cond. |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | Dry |
Tensile Strength | |||
Break | *** Mpa | ISO 527-1/-2 | Cond. |
Break | *** Mpa | ISO 527-1/-2 | Dry |
Tensile Elongation | |||
Break | *** % | ISO 527-1/-2 | Cond. |
Break | *** % | ISO 527-1/-2 | Dry |
Flexural Modulus | *** Mpa | ISO 178 | Cond. |
Flexural Modulus | *** Mpa | ISO 178 | Dry |
Flexural Strength | |||
- | *** Mpa | ISO 178 | Cond. |
- | *** Mpa | ISO 178 | Dry |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Charpy Notched Impact Strengh | |||
23℃ (73℉) | *** kJ/m² | ISO 179/1eA | Cond. |
23℃ (73℉) | *** kJ/m² | ISO 179/1eA | Dry |
Charpy Unnotched Impact Strengh | |||
-30℃ (-22℉) | *** kJ/m² | ISO 179/1eU | Dry |
23℃ (73℉) | *** kJ/m² | ISO 179/1eU | Cond. |
23℃ (73℉) | *** kJ/m² | ISO 179/1eU | Dry |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
0.45 Mpa (66 psi)（4.6kg/cm²） | *** °C | ISO 75-1/-2 | |
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ISO 75-1/-2 | |
Coefficient of Linear Thermal Expansion | |||
Flow | *** E-6/K | ISO 11359-1/-2 | (23-55)°C |
Across Flow | *** E-6/K | ISO 11359-1/-2 | (23-55)°C |
Melt Temperature(Tm) | *** °C | ISO 11357-1/-3 | DSC |
Processing Temperature | ***~*** °C | - | Injection moulding/Extrusion |
Mould temperature | ***~*** °C | - | Injection moulding |
Temperature index (TI)-Tensile Strength | |||
5000 h | *** °C | IEC 60216 | 50% loss of tensile strength |
20000 h | *** °C | IEC 60216 | 50% loss of tensile strength |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
V-0 | *** mm | UL94 | |
5VA | *** mm | UL94 | |
Glow Wire Flammability Index(GWFI) | |||
0.75mm | *** °C | IEC 60695-2-12 | |
Glow Wire Ignition Test(GWIT) | |||
0.75mm | *** °C | IEC 60695-2-13 | |
European Railways Certifications | *** HL | EN 45545-2 | 0,8 - 3mm |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-m | IEC 62631-3-1 | Cond. |
Volume Resistivity | *** Ohm-m | IEC 62631-3-1 | Dry |
Surface Resistivity | *** Ohm | IEC 62631-3-2 | Cond. |
Dielectric Constant(Permittivity) | |||
1MHz | *** - | IEC 62631-2-1 | Cond. |
1MHz | *** - | IEC 62631-2-1 | Dry |
Dissipation Factor | |||
1MHz | *** E-4 | IEC 62631-2-1 | Cond. |
1MHz | *** E-4 | IEC 62631-2-1 | Dry |
Comparative Tracking Index (CTI) | |||
Solution A | *** V | IEC 60112 | |
Dielectric Strength | *** kV/mm | IEC 60243-1 | Dry, K20/K20, (60*60*1 mm³) |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
