Polypropylene Z9450 is a low melting, high ethylene random copolymer with improved color, optics and impact properties.
Heat Sealable: The very low melting point of Z9450 makes it an excellent heat seal layer for oriented films.
FDA: Z9450 is recommended for use in non-oriented film processes for manufacture of packaging films that require improved optical and impact properties and as a heat seal layer for oriented films.
Recommended Applications: Z9450 is recommended for use in non-oriented film processes for manufacture of packaging films that require improved optical and impact properties and as a heat seal layer for oriented films.
Processing: Z9450 resin processes on film extrusion equipment with typical melt temperatures of 380°F-440°F (193°C-227°C).
| Original Document | Technical Datasheet(English) | |||
| Processing | Cast FilmFilm Extrusion | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D 1505 | |
Melt Mass Flow Rate(MFR) | |||
- | *** g/10min | ASTM D1238 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Melt Temperature(Tm) | *** °C | DSC | |
| Optical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Haze | *** % | ASTM D1003 | |
Gloss | *** % | ASTM D 2457 | 45° |
| Film | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Strength | |||
Break | *** Mpa | ASTM D 882 | |
Secant Modulus | *** Mpa | ASTM D 882 | 1% Secant Modulus |
Dart Drop Impact | *** g/mil | ASTM D 1709 | F50 |
Water Vapor Transmission Rate | *** g/100in²/day | ASTM E96 | |
Seal Initiation Temperature | *** ℃ | ASTM F88 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
