HCG2530MP is high rigidity and balance tenacity 30%GF PC resin.It has excellent surface, high NCVM rate, easy to machining ,high stability and super shape resistance property. HCG2530MP is mainly used in mobile phone
| Original Document | Technical Datasheet-ASTM(English) | |||
| Features | High Stiffness/RigidityGood SurfaceGood PaintablilityFilled & Reinforced | |||
| Reinforced | 30% Glass Fiber | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D792 | |
Melt Mass Flow Rate(MFR) | |||
300℃/1.2 kg | *** g/10min | ASTM D1238 | |
Mold Shrinkage | |||
- | ***~*** % | ASTM D955 | |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Strength | |||
- | *** Mpa | ASTM D 638 | |
Tensile Elongation | |||
Break | *** % | ASTM D638 | |
Flexural Modulus | *** Mpa | ASTM D790 | |
Flexural Strength | |||
- | *** Mpa | ASTM D790 | |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Izod Notched Impact Strengh | |||
23℃ (73℉) | *** J/m | ASTM D256 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ASTM D648 | |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
HB | *** mm | UL94 | |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-cm | IEC 60093 | |
Surface Resistivity | *** Ohm | IEC 60093 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
