Reny™ LDS Grades; feature, benefit and use
LDS technology
Circuit formation onto molded structural components with three-dimensional design freedom.
· Applicable to small/curved surfaces and thin-walled products to reduce number of parts and weight.
· Less than 100 μm circuit line distance, affording size reduction of the components.
Reny™ LDS grades
· 1002PS : Good appearance, high rigidity (more than 13GPa)
· XHP1002: High heat resistance (melting point 290℃), bio-base polymer used
Features
· Suitable to produce injection-molded MIDs for the LDS technology developed by LPKF Laser & Electronics AG.
· High strength & high modulus.
| Original Document | Technical Datasheet(Chinese) Technical Datasheet(English) | |||
| Features | Heat ResistanceLaser Direct StructuringBio-based | |||
| Processing | Injection3D Printing | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ISO 1183 | |
Water Absorption | *** % | - | 23℃, 50%RH |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | 50%RH |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | DRY |
Tensile Strength | |||
Break | *** Mpa | ISO 527-1/-2 | 50%RH |
Break | *** Mpa | ISO 527-1/-2 | DRY |
Tensile Elongation | |||
Break | *** % | ISO 527-1/-2 | 50%RH |
Break | *** % | ISO 527-1/-2 | DRY |
Flexural Modulus | *** Mpa | ISO 178 | 50%RH |
Flexural Modulus | *** Mpa | ISO 178 | DRY |
Flexural Strength | |||
- | *** Mpa | ISO 178 | 50%RH |
- | *** Mpa | ISO 178 | DRY |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Charpy Notched Impact Strengh | |||
- | *** kJ/m² | ISO 179/1eA | 50%RH |
- | *** kJ/m² | ISO 179/1eA | DRY |
Charpy Unnotched Impact Strengh | |||
- | *** kJ/m² | ISO 179/1eU | 50%RH |
- | *** kJ/m² | ISO 179/1eU | DRY |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ISO 75-1/-2 | 50%RH |
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ISO 75-1/-2 | DRY |
Coefficient of Linear Thermal Expansion | |||
Flow | *** E-6/°C | ISO 11359-2 | |
Across Flow | *** E-6/°C | ISO 11359-2 | |
Processing Temperature | ***~*** °C | - | |
Mould temperature | ***~*** °C | - | |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
HB | *** mm | UL94 | |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Dielectric Constant(Permittivity) | |||
100Hz | *** - | IEC 60250 | |
1MHz | *** - | IEC 60250 | |
Dissipation Factor | |||
100Hz | *** E-4 | IEC 60250 | |
1MHz | *** E-4 | IEC 60250 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
