As etch and deposition wafer processing operations use  more diverse chemistries to maintain control of critical  features typical of 3D architectures and devices, the  sealing environment demands increase as well. These  harsh environments often break down materials, causing  harmful particulation and reduced wafer process  equipment productivity. 

Greene Tweed’s Chemraz® XPE-HP leverages an  advanced perfluoroelastomer formulation that is highly  resistant to O2  plasma, ozone, and UV environments,  and stands up to fluorine-based plasmas such as CF4 and NF3. 

Chemraz® XPE-HP offers the semiconductor industry an  alternative to products that quickly erode and particulate  in advanced wafer processing operations. With superior  resistance to both radical oxygen and fluorine environments, this material affords increased chip yield and  MTBC (mean time between cleans).

Features and Benefits 

• High UV and ozone resistance enables next-generation  process technology insertions 

• Superior O2  plasma resistance results in improved  product integrity 

• High-temperature capability 

• Reduced erosion and particulation 

• Decreased maintenance and replacement requirements 

• Excellent compression set 

Applications 

• Chamber and slit valve seals • Endpoint windows • Gas inlet/outlet seals • Gate and isolator valve seals • Reactant delivery system seals • Reaction chamber lid seals