Chemraz® XRZ, a perfluoroelastomer, is specifically  developed to exceed the most rigorous demands of  aggressive in situ NF3  plasma cleaning.  

Chemraz® XRZ withstands the application challenges  typically found in HDPCVD (high-density plasma chemical  vapor deposition), PECVD (plasma enhanced CVD),  and newer PEALD (plasma-enhanced atomic layer  deposition) process chambers. 

Because of its unique molecular composite structure,  Chemraz® XRZ provides the highest plasma resistance  available to fluorine plasma processes, resulting in  minimal contamination. This leads to increased seal  integrity and longer seal lifetimes, reducing downtime  and driving higher wafer processing yields.

Chemraz® XRZ can be used for both static and semidynamic dry wafer processing applications such as etch,  deposition (CVD, HDPCVD, PEALD), and remote plasma  cleans. Chemraz® XRZ remains stable at operating  temperatures up to 572°F (300°C) while maintaining  exceptional compression set.

Features and Benefits 

• Outstanding plasma resistance in highly corrosive  fluorine environments with minimal seal degradation 

• Excellent surface resistance for minimal particulation  and sealing integrity 

• High purity for minimal contamination risk 

• Minimal compression set at elevated temperatures  ensures seal integrity 

• Extended equipment uptime with added reliability  in dry applications 

Applications 

• Chamber seals • Endpoint windows • Gas inlet/outlet seals • Gate valve seals• Isolator valve seals • Reactant delivery system seals • Reaction chamber lid seals • Slit valve seals