Protection against oxygen-infused plasma is key in many  etch chamber environments. These harsh environments  often break down non-resistant materials, causing harmful  particulation and, ultimately, defective chips.  

Greene Tweed’s Chemraz® XPE is highly resistant to O2 plasma and can be used in a wide range of applications,  such as slit valve doors, reaction chamber lid seals, and  gate valve seals. This advanced elastomeric material  offers the semiconductor and solar industry an alternative to legacy products that quickly erode in the oxygen  environment. With excellent resistance to both O2  and  CF4  plasmas, this material affords an increased chip yield  and maximized production. In addition, XPE seals provide  customers with an increased MTBR (mean time between  repair) to reduce downtime and maintenance costs.

Features and Benefits 

• High-temperature capability enables future  technology and next-generation applications 

• Superior O2  plasma resistance resulting in  improved product integrity 

• High CF4  plasma resistance 

• Reduced product weight loss 

• Decreased maintenance and replacement  requirements

• Excellent compression set performance 

Applications 

• Chamber and slit valve seals • Endpoint windows • Gas inlet/outlet seals • Gate and isolator valve seals • Reactant delivery system seals • Reaction chamber lid seals