Teflon™  FFR 880 fluoroplastic foam resin was developed  to meet the demand for superior micro-coaxial designs  required for manufacturing compact electronic devices.  Foamed insulation of Teflon™  FFR 880 fluoroplastic foam  resin provides high-speed data transmissions with minimal  distortion and exceptional signal return loss and attenuation  performance in ultra-thin wire and cable applications.  In addition, the resin’s high thermal stability and melt  flow rate (nominal MFR of 42) allow for high processing  speeds and excellent heat resistance. 

Teflon™  FFR 880  fluoroplastic foam resin offers cable designers opportunities  for miniaturization and weight savings or the use of larger  conductors to construct low-loss cables, without the need  for increased dielectric dimensions. Teflon™  FFR 880 has been compounded with a proprietary  foam nucleating package and is supplied as white pellets.  This resin is used in a nitrogen gas-injected foam extrusion  process to produce uniform foam cells in the dielectric  insulation. 

In micro-coaxial cables using Teflon™  FFR 880 fluoroplastic foam resin, a typical cable core would have conductor sizes of 26 AWG or smaller, wall thickness of 0.002 in or greater,  with void content up to 55%. These voids are closed cell in  nature and range from 0.0002 in (0.006 mm) to 0.0013 in  (0.033 mm) in diameter. Achievable cell size and void content  will vary based on wall thickness and processing conditions.