A Fluoropolymer with Optical Clarity and Gas Permeability
Teflon™ AF (amorphous fluoropolymer) resins have the same excellent optical clarity and mechanical properties of amorphous polymers. These resins also perform well over a wide range of temperatures and maintain outstanding electrical properties and chemical resistance. A unique chemical structure enhances their versatility and distinguishes this class from other fluoropolymers.
Features and Benefits
As high-performance fluoropolymer resins, Teflon™ AF resins offer chemical resistance and high thermal resistance. The special molecular structure of these amorphous fluoropolymer resins offer additional benefits, which include:
-Optical clarity
-Low refractive index
-Exceptional UV stability and transmission capability
-Dimensional stability
-Reduced mold shrinkage
-Low dielectric constant (1.89 to 1.93), even at gigahertz frequencies
-Low dissipation factor and moisture sensitivity/moisture absorption
-High compressibility and gas permeability
-Solubility in perfluorinated solvents
-Teflon™ AF Grades
-Teflon™ AF is available as a powdered resin or solution in two grades: AF 1600X (*Tg 160 °C [320 °F]) and AF 2400X-J (Tg 240 °C [464 °F]).
Resins
AF 1600X
AF 2400X-J
Solutions
AF 2400 1%
AF 1601 6%
AF 1601 18%
Applications
Teflon™ AF resins can be used in unlimited applications to meet current and future material challenges.
Optical Materials
Teflon™ AF products offer plenty of flexibility. They function as a clear coating for optical devices requiring a low refractive index. They also perform well in aggressive chemical environments with disparate temperatures and light waves (UV-IR).
Applications in this category include lens covers for microwave, radar, and optical devices; fiber optics, optical cladding; optoelectronic devices; UV cells and windows; passivation and protective coatings; and anti-reflective coatings for optical devices.
3D Printing
The optical clarity and gas permeability of films made with Teflon™ AF products enable efficient 3D printing and manufacturing.
Semiconductors and Processing Materials
Thanks to good dimensional stability, rigidity at high-use temperatures, and chemical inertness, Teflon™ AF products provide critical electrical properties for the next generation of computer chips.
Dielectric Materials
Teflon™ AF products are easy to mold and spin cast. Other uses include passivation layers and encapsulation for hybrid/sandwich integrated circuit packaging.
Biomedical Materials
Teflon™ AF solutions can be coated onto other substrates to enhance biocompatibility for optical sensing and diagnostic applications. They can also be used as a potential separation media for gases and liquids.
| Original Document | Technical Datasheet(English) | |||
| Appearance | Powder | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D792 | |
Water Absorption | *** % | - | |
Viscosity | *** Pa-s | ASTM D 3835 | 350°C, 100 s-1 |
Abrasion resistance | *** mm³ | Internal | 2000 cycles |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ASTM D638 | |
Tensile Strength | |||
Yield | ***~*** Mpa | ASTM D638 | 220°C |
Yield | ***~*** Mpa | ASTM D638 | 23°C |
- | ***~*** Mpa | ASTM D 638 | 220°C |
- | ***~*** Mpa | ASTM D 638 | 23°C |
Tensile Elongation | |||
Break | ***~*** % | ASTM D638 | 220°C |
Break | ***~*** % | ASTM D638 | 23°C |
Flexural Modulus | ***~*** Mpa | ASTM D790 | 220°C |
Flexural Modulus | ***~*** Mpa | ASTM D790 | 23°C |
| Hardness | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Rockwell | *** - | ASTM D785 | 23°C |
Shore D hardness | *** D | ASTM D 2240 | 220°C |
Shore D hardness | *** D | ASTM D 2240 | 23°C |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
0.45 Mpa (66 psi)(4.6kg/cm²) | *** °C | ASTM D648 | |
1.8 Mpa (264 psi)(18.6kg/cm²) | *** °C | ASTM D648 | |
Coefficient of Linear Thermal Expansion | |||
- | *** E-6/°C | ASTM D E831 | |
Melt Temperature(Tm) | ***~*** °C | ASTM D3418 | |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Dielectric Constant(Permittivity) | |||
- | *** - | ASTM D150 | |
Dissipation Factor | |||
- | ***~*** E-4 | ASTM D 150 | |
Dielectric Strength | *** kV/mm | ASTM D149 | |
| Optical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Light Transmission | *** % | ASTM D1003 | |
Refractive Index | *** - | ASTM D542 | |
Abbe Number | *** - | Internal | |
| Film | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Water Vapor Transmission Rate | *** Barrer | Internal | |
Gas permeability | *** Barrer | Internal | Nitrogen |
Oxygen permeability | *** Barrer | Internal | |
Carbon Dioxide transm. rate | *** Barrer | Internal | |
Surface Energy | *** dynes/cm | ASTM D 5946 | |
| Additional Information | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Contact Angle with Water | *** Degrees | ASTM D570 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.