Features
●Low dielectric dissipation factor
●Low water absorption, so there is little change in the dielectric properties and dimensions under humid conditions.
●Homogeneous materials, so the dielectric properties are very uniform.
●Good processability
| Original Document | Technical Datasheet(English) | |||
| Features | Easy processingLow Moisture Absorption | |||
| Appearance | Film | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Moisture /Humidity Absorption | *** % | Internal | 50μm, 23℃, 50% R.H. |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Coefficient of Linear Thermal Expansion | |||
- | *** E-6/°C | TMA | 50μm |
Melt Temperature(Tm) | *** °C | DSC | 50μm |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
VTM-0 | *** mm | UL 94 | 50μm |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-cm | IEC 62631-3-1 | 50μm |
Surface Resistivity | *** Ohm | IEC 62631-3-2 | 50μm |
Dielectric Constant(Permittivity) | |||
28 GHz | *** - | Internal | 50μm,25℃, xy direction |
Dissipation Factor | |||
28 GHz | *** E-4 | Internal | 50μm,25℃, xy direction |
Dielectric Strength | *** kV/mm | IEC 60243-1 | 50μm |
| Film | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Strength | |||
- | *** Mpa | Internal | 50μm |
Tensile Elongation | |||
- | *** % | Internal | 50μm |
Tensile Modulus | *** Mpa | Internal | 50μm |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
