DuPont™ Kapton® EN is a premium performance polyimide film  for use as a dielectric substrate for flexible printed circuits and  high density interconnects. Kapton® EN is the preferred  dielectric film for very fine pitch circuitry due to its superior  dimensional stability, lay-flflat, high modulus, and a coefficient of  thermal expansion match to copper. Kapton® EN is offered in a  wide range of thickness from 5 µm ultra-thin to 50 µm thick,  which provides more design flexibility to the customer.  

The excellent electrical characteristics and chemical etchability  inherent to Kapton® HN and VN films have been maintained in  Kapton® EN polyimide film. Kapton® EN film also has very low  moisture absorption and is laser ablatable.

Applications 

• Flexible printed circuits  

• Fine pitch circuitry  

• Chip scale packaging  

• High density interconnects 

Key Features 

• Thinnest polyimide film available Worldwide. Provides for  thinner devices and narrower bezel designs 

• Excellent dimensional stability with low CTE matching copper 

• Low curl, high dynamic flexibility and excellent bend-to-install  performance 

• Higher modulus film with lower water uptake 

• Consistent lot-to-lot quality