Super-heat resistant polyimide film produced from UBE’s exclusive “BPDA (Biphenyl tetracarboxylic dianhydride)“ monomers.
This formulation is unique to UBE and exhibits outstanding dimensional stability, low water absorption and very high chemical resistance.
“UPILEX®-SGA” is a polyimide film having improved adhesion properties created by a special process to both sides of the “UPILEX®-S”. It is suitable for sputtering or plating processes because of high surface adhesion. It offers a flexible base for high-performance electronic circuits.
In addition, it can also be used as an adhesive tape base material for LOC packaging.
●In sputtering or plating, a flexible base for electronic circuits that does not use any adhesives can be obtained.
●Peel strength is high, surface smoothness is very high.
●Superior mechanical property, with low water absorption, excellent dimensional stability and high heat resistance comparable to “UPILEX®-S”.
| Original Document | Technical Datasheet(English) | |||
| Features | Heat ResistanceDimensional StabilityMetal PlatingGood AdhesionChemical ResistanceLow Moisture Absorption | |||
| Appearance | Film | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D 1505 | |
Water Absorption | *** % | ASTM D570 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Coefficient of Linear Thermal Expansion | |||
- | *** E-6/°C | Internal | 50-200°C |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-m | ASTM D257 | DC 100V |
Surface Resistivity | *** Ohm | ASTM D257 | DC 100V |
Dielectric Constant(Permittivity) | |||
1 GHz | *** - | Internal | |
Dissipation Factor | |||
1 GHz | *** E-4 | Internal | |
Dielectric Strength | *** kV/mm | ASTM D149 | 60Hz |
| Film | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Strength | |||
- | *** Mpa | ASTM D882 | |
Tensile Elongation | |||
Break | *** % | ASTM D 882 | |
Tensile Modulus | *** Mpa | ASTM D 882 | |
Free/Heat Shrinkage | *** % | ASTM D 1204 | 200°C, 2h |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
