Super-heat resistant polyimide film produced from UBE’s exclusive “BPDA (Biphenyl tetracarboxylic dianhydride)“ monomers.
This formulation is unique to UBE and exhibits outstanding dimensional stability, low water absorption and very high chemical resistance.
“UPILEX®-VT” and ”UPILEX®-NVT” are heat bonding polyimide films having heat fusing layers on both side of the film, created by the polyimide resin equivalent of “UPILEX®-S”.
High quality flflexible circuits without an adhesive layer are obtained, by heating and pressing “UPILEX®-VT” or ”UPILEX®-NVT” with metal (Cu, SUS, Al) foil.
In addition, they are also available for bonding films comprised of metal, ceramic and other materials.
●Flexible circuits without adhesive are produced.
●This offers high tensile strength and tear strength.
●Offering the same low water absorption, low dimensional change and high heat resistance as “UPILEX®-S”, with the addition of laminate workability in the heat press.
| Original Document | Technical Datasheet(English) | |||
| Features | Heat ResistanceDimensional StabilityGood AdhesionChemical ResistanceLow Moisture Absorption | |||
| Appearance | Film | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D 1505 | |
Water Absorption | *** % | ASTM D570 | |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tear Strength | *** N/mm | Internal | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Coefficient of Linear Thermal Expansion | |||
- | *** E-6/°C | Internal | 50-300°C |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
V-0 | *** mm | UL94 | |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-m | ASTM D257 | DC 100V |
Surface Resistivity | *** Ohm | ASTM D257 | DC 100V |
Dielectric Constant(Permittivity) | |||
1 GHz | *** - | Internal | |
10 GHz | *** - | Internal | |
Dissipation Factor | |||
1 GHz | *** E-4 | Internal | |
10 GHz | *** E-4 | Internal | |
Dielectric Strength | *** kV/mm | ASTM D149 | 60Hz |
| Film | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Strength | |||
- | *** Mpa | ASTM D882 | |
Tensile Elongation | |||
Break | *** % | ASTM D 882 | |
Tensile Modulus | *** Mpa | ASTM D 882 | |
Free/Heat Shrinkage | *** % | ASTM D 1204 | 300°C, 2h |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
