Typical Applications
Foamed insulation boards, electronic device insulation material
| Original Document | Technical Datasheet(Chinese&English) | |||
| Features | Foamable | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Melt Mass Flow Rate(MFR) | |||
200 ℃/5 Kg | *** g/10 min | ISO 1133 | |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Strength | |||
Break | *** Mpa | ISO 527 | |
Flexural Modulus | *** Mpa | ISO 178 | |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Charpy Unnotched Impact Strengh | |||
23℃ (73℉) | *** kJ/m² | ISO 179 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Vicat Softening Temperature(VST) | *** °C | ISO 306 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
