POLYIMIDE DIRECT-FORMED PARTS
DuPont™ Vespel® ST-2030 parts and shapes are used in applications in which low thermal expansion is more important than strength (which is slightly reduced).
Applications may include bearings, bushings and washers.
ST-2030 is a filled polymer with a lower coefficient of thermal expansion and lower elongation than ST-2010.
| Original Document | Technical Datasheet(English) | |||
| Features | Low CLTE | |||
| Appearance | Parts/ Shapes | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D272 | 23 °C |
Water Absorption | *** % | ASTM D570 | 24 h, 23 °C |
Water Absorption | *** % | ASTM D570 | 48 h, 23 °C |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ASTM D638 | 23 °C |
Tensile Strength | |||
- | *** Mpa | ASTM D 638 | 23 °C |
- | *** Mpa | ASTM D 638 | 260 °C |
Tensile Elongation | |||
Break | *** % | ASTM D638 | 23 °C |
Compressive Modulus | *** Mpa | ASTM D 695 | 23 °C |
Compressive Strength | *** Mpa | ASTM D 695 | 23 °C, Ultimate |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Coefficient of Linear Thermal Expansion | |||
- | *** E-6/°C | ASTM D 696 | 23 °C to 260 °C |
Thermal Conductivity | *** W/m-°C | ASTM F433 | 23 °C to 260 °C |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-cm | ASTM D257 | 23 °C |
Surface Resistivity | *** Ohm | ASTM D257 | 23 °C |
Dielectric Constant(Permittivity) | |||
100Hz | *** - | ASTM D 150 | 23 °C |
10 kHz | *** - | ASTM D 150 | 23 °C |
1MHz | *** - | ASTM D 150 | 23 °C |
Dissipation Factor | |||
100Hz | *** E-4 | ASTM D 150 | 23 °C |
10 kHz | *** E-4 | ASTM D 150 | 23 °C |
1MHz | *** E-4 | ASTM D150 | 23 °C |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
