Main features
- developed for the LPKF-LDS® process
-low thermal expansion
Target Industries
-automotive industry
-electrical engineering
-LED lighting technology
-mechanical engineering
| Original Document | Technical Datasheet(English) | |||
| Features | Low CLTELaser Direct Structuring | |||
| Appearance | Black | |||
| Processing | Injection | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | Internal | |
Mold Shrinkage | |||
Flow | *** % | ISO 294-4 | |
Across Flow | *** % | ISO 294-4 | |
Water Absorption | *** % | ISO 62 | 23 °C / 50 % relative humidity up to saturation |
Bulk(Apparent ) Density | *** g/cm³ | ISO 60 | |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ISO 527-1 | |
Tensile Strength | |||
- | *** Mpa | ISO 527-1 | |
Tensile Elongation | |||
Break | *** % | ISO 527-1 | |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Charpy Unnotched Impact Strengh | |||
- | *** kJ/m² | ISO 179/1eU | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ISO 75-2/A | |
Specific Heat | *** J/g-°C | DIN EN 821 | |
Coefficient of Linear Thermal Expansion | |||
Flow | *** E-6/K | ISO 11359-1/-2 | 100 - 150 °C |
Flow | *** E-6/K | ISO 11359-1/-2 | 150 - 200 °C |
Flow | *** E-6/K | ISO 11359-1/-2 | 200 - 250 °C |
Flow | *** E-6/K | ISO 11359-1/-2 | 50 - 100 °C |
Across Flow | *** E-6/K | ISO 11359-1/-2 | 100 - 150 °C |
Across Flow | *** E-6/K | ISO 11359-1/-2 | 150 - 200 °C |
Across Flow | *** E-6/K | ISO 11359-1/-2 | 200 - 250 °C |
Across Flow | *** E-6/K | ISO 11359-1/-2 | 50 - 100 °C |
Melt Temperature(Tm) | *** °C | Internal | |
Thermal Conductivity | *** W/(m K) | DIN EN 821 | in-plane |
Thermal Conductivity | *** W/(m K) | DIN EN 821 | through-plane |
Thermal Diffusivity | *** mm²/s | DIN EN 821 | in-plane |
Thermal Diffusivity | *** mm²/s | DIN EN 821 | through-plane |
Continuous Use Temperature | |||
Long term | *** °C | Internal | long term |
Temperature at Short Circle Operation | *** °C | Internal | |
Processing Temperature | ***~*** °C | - | |
Mould temperature | ***~*** °C | - | |
| Flammability | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Flame Rating | |||
V-0 | *** mm | IEC 60695-11-10 | |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-m | IEC 61340-2-3 | |
Surface Resistivity | *** Ohm | IEC 61340-2-3 | |
Dielectric Constant(Permittivity) | |||
1 GHz | *** - | Internal | |
Comparative Tracking Index (CTI) | |||
- | *** V | IEC 60112 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
| Chinese | English | File Format | Action |
|---|---|---|---|
| 物性表(英文) | Technical Datasheet(English) | Down Load |
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