Enable™ 2010 resins are ethylene 1-hexene copolymers. Enable™ performance polymer resins offer an outstanding balance between processing and film properties, including tensile, impact and puncture. TnPP is not intentionally added to Enable™ 2010 resins.
| Original Document | Technical Datasheet(English) Technical Datasheet(Chinese) | |||
| Additive | Heat StabilizerProcessing Aid | |||
| Appearance | Pellets/Granules | |||
| Processing | Cast FilmBlown FilmBlow-Fill-Seal(BFS) | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D 1505 | |
Melt Mass Flow Rate(MFR) | |||
190℃/2.16 kg | *** g/10min | ASTM D1238 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Vicat Softening Temperature(VST) | *** °C | Internal | |
Melt Temperature(Tm) | *** °C | Internal | Peak |
| Optical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Haze | *** % | ASTM D1003 | |
Gloss | *** - | ASTM D 2457 | 45° |
| Film | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Strength | |||
Yield | *** Mpa | ASTM D 882 | MD |
Yield | *** Mpa | ASTM D 882 | TD |
Break | *** Mpa | ASTM D 882 | MD |
Break | *** Mpa | ASTM D 882 | TD |
Tensile Elongation | |||
Break | *** % | ASTM D 882 | MD |
Break | *** % | ASTM D 882 | TD |
Piercing strength | *** N | Internal | |
Puncture resistance | *** J | Internal | |
Elmondorf Tear | *** g | ASTM D 1922 | MD |
Elmondorf Tear | *** g | ASTM D 1922 | TD |
Secant Modulus | *** Mpa | ASTM D 882 | MD, 1% Secant |
Secant Modulus | *** Mpa | ASTM D 882 | TD, 1% Secant |
Dart Drop Impact | *** g | ASTM D 1709 |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.