FUSABOND™ M603 Resin is a random ethylene copolymer, incorporating a monomer which is classified as being a maleic anhydride equivalent for application uses.
The exact composition is considered to be proprietary information.
Applications
FUSABOND™ M603 is used in a variety of applications where adhesion improvements are needed for coatings, or compatibilization is need for compounds. In these applications, the FUSABOND™ resin is typically dry blended with a polyolefin matrix polymer for further processing.
Examples include: Adhesives, Polymer Modification, Wood-Plastic Composites
| Original Document | Technical Datasheet(English) | |||
| Features | Good Adhesion | |||
| Processing | Compounding | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D792 | |
Melt Mass Flow Rate(MFR) | |||
190℃/2.16 kg | *** g/10min | ASTM D1238 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Melt Temperature(Tm) | *** °C | ASTM D3418 | DSC |
Processing Temperature | *** °C | - | Maximum Processing Temperature |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
