Thermal conductive material
| Original Document | Technical Datasheet(English) | |||
| Status | Business Restructured | |||
| Features | Heat StabilizedThermal Conductive | |||
| Additive | Heat Stabilizer | |||
| Processing | Injection | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ISO 1183 | dry |
Mold Shrinkage | |||
Flow | *** % | ISO 294-4 | dry |
Across Flow | *** % | ISO 294-4 | dry |
Moisture /Humidity Absorption | *** % | ISO 62 | dry |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ISO 527-1/-2 | dry |
Tensile Strength | |||
Break | *** Mpa | ISO 527-1/-2 | dry |
Tensile Elongation | |||
Break | *** % | ISO 527-1/-2 | dry |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Coefficient of Linear Thermal Expansion | |||
Flow | *** E-6/°C | ISO 11359-1/-2 | dry |
Across Flow | *** E-6/°C | ISO 11359-1/-2 | dry |
Melt Temperature(Tm) | *** °C | ISO 11357-1/-3 | dry |
Thermal Conductivity | *** W/(m K) | ASTM E 1461 | in plane |
Thermal Conductivity | *** W/(m K) | ASTM E 1461 | through plane |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Volume Resistivity | *** Ohm-m | IEC 60093 | dry |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
