LNP THERMOCOMP UX08319 is PPA base glass fiber filled compounds, good for LDS (Laser direct structuring)application. Additional feature is high heat.
| Original Document | Technical Datasheet(English) | |||
| Features | Heat ResistanceLaser Direct StructuringFilled & Reinforced | |||
| Reinforced | Glass Fiber | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D792 | |
Mold Shrinkage | |||
Flow | *** % | Internal | |
Across Flow | *** % | Internal | |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ASTM D638 | 5 mm/min |
Tensile Strength | |||
Break | *** Mpa | ASTM D638 | Type I, 5 mm/min |
Tensile Elongation | |||
Break | *** % | ASTM D638 | Type I, 5 mm/min |
Flexural Modulus | *** Mpa | ASTM D790 | 1.3 mm/min, 50 mm span |
Flexural Strength | |||
Yield | *** Mpa | ASTM D790 | 1.3 mm/min, 50 mm span |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Izod Notched Impact Strengh | |||
23℃ (73℉) | *** J/m | ASTM D256 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ASTM D648 | 3.2 mm, unannealed |
| Electrical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Dielectric Constant(Permittivity) | |||
1.9 GHz | *** - | Internal | |
Dissipation Factor | |||
1.9 GHz | *** E-4 | Internal |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
