LNP THERMOCOMP LX08411 is a compound based on Polyetheretherketone resin containing Carbon Fiber. Added feature of this material is: Opaque.
| Original Document | Technical Datasheet(English) | |||
| Features | Filled & Reinforced | |||
| Appearance | Opaque Color | |||
| Reinforced | Carbon Fiber | |||
| Physical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
|---|---|---|---|
Density/Specific Gravity | *** g/cm³ | ASTM D792 | |
Mold Shrinkage | |||
Flow | ***~*** % | ASTM D955 | flow, 24 hrs |
Across Flow | ***~*** % | ASTM D955 | xflow, 24 hr |
Moisture /Humidity Absorption | *** % | ASTM D 570 | 50% RH, 24 hrs |
| Mechanical | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Tensile Modulus | *** Mpa | ASTM D638 | 50 mm/min |
Tensile Strength | |||
Yield | *** Mpa | ASTM D638 | Type I, 5 mm/min |
Break | *** Mpa | ASTM D638 | Type I, 5 mm/min |
Tensile Elongation | |||
Yield | *** % | ASTM D638 | Type I, 5 mm/min |
Break | *** % | ASTM D638 | Type I, 5 mm/min |
Flexural Modulus | *** Mpa | ASTM D790 | 1.3 mm/min, 50 mm span |
Flexural Strength | |||
Yield | *** Mpa | ASTM D790 | 1.3 mm/min, 50 mm span |
Break | *** Mpa | ASTM D790 | 1.3 mm/min, 50 mm span |
| Impact | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Izod Notched Impact Strengh | |||
23℃ (73℉) | *** J/m | ASTM D256 | |
Izod Unnotched Impact Strengh | |||
23℃ (73℉) | *** J/m | ASTM D4812 | |
| Thermal | Value/Unit(Sign in to View) | Test Standard | Test Condition |
Heat Deflection Temperature(HDT) | |||
0.45 Mpa (66 psi)（4.6kg/cm²） | *** °C | ASTM D648 | 3.2 mm, unannealed |
1.8 Mpa (264 psi)（18.6kg/cm²） | *** °C | ASTM D648 | 3.2 mm, unannealed |
The information presented on this datasheet was acquired by AjiEng.com from the producer of the material. AjiEng.com makes substantial efforts to assure the accuracy of this data. However, AjiEng.com assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.
